Description

FLIR Boson® – 6.3mm Lens

Name: TELEDYNE FLIR BOSON 320 X 256 6.3MM 34° HFOV - LWIR THERMAL CAMERA CORE
SKU: 744
Price: 1680.00 USD
Availability: InStock

Compact LWIR Thermal Camera

The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

With a weight as low as 7.5 g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.

DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

A full-featured VGA thermal camera module at less than 4.9 cm³.

21 x 21 x 11 mm camera body and weight as low as 7.5 g.
Low power consumption, starting at 500 mW
12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
Rugged construction and highest temperature rating -40°C to 80°C.

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Includes embedded algorithms for noise filters, gain control, blending, and more.
Software-customizable functionality for video processing and power dissipation requirements.
Built-in support for physical and protocol-level interface standards.

WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

Unprecedented integration flexibility for fast, affordable developments.

Customized applications through FLIR-trusted third party developers.
Mechanical/electrical compatibility across all versions.
Variety of hardware and image processing integration to fit OEM requirements.

Specifications

OVERVIEW
Spectral Band	LWIR \| 7.5 µm – 13.5 µm
Resolution	320 × 256 Pixels
Sensitivity/NEdT	<40 mK (Industrial) \| <50 mK (Professional) \| <60 mK (Consumer)
Pixel Pitch	12 µm
f-number	1
Weight	7.5 g without lens (configuration dependent)
Dimensions (L x W x H)	21 × 21 × 11 mm without lens
ELECTRICAL & MECHANICAL
Control Channels	UART or USB
Peripheral Channels	I2C, SPI, SDIO
Video Channels	CMOS or USB2
IMAGING & OPTICAL
Full Frame Rate	60Hz baseline; 30 Hz runtime selectable
Image Orientation	Adjustable (vertical flip and/or horizontal flip)
Non-Uniformity Correction (NUC)	Factory calibrated; updated FFCs with FLIR’s Silent Shutterless NUC (SSN™)
Scene Range [high gain]	to +140 °C (high)
Scene Range [low gain]	+500 °C (low)
Slow Frame Rate	≤9 Hz available
Snapshots	Full-frame snapshot, SDIO interface to support removable media
Solar protection	Integral
Sensor Technology	Uncooled VOx microbolometer
Symbology	Re-writable each frame; alpha blending for translucent overlay
Continuous Digital Zoom	1X to 8X zoom
ENVIRONMENTAL
Operational Altitude	12 km (max altitude of a commercial airliner or airborne platform)
Operating Temperature Range	-40°C to 80°C
Shock	1,500 g @ 0.4 msec
POWER
Input Voltage	3.3 VDC
Power Dissipation	Varies by configuration; as low as 500 mW
MECHANICAL
Precision Mounting Holes	Four tapped M1.6×0.35 (rear cover). Lens support recommended when lens mass exceeds core mass.